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TecpolyTM
IH Polyimide film
TecpolyTM IH Polyimide Film
is made from the synthetic resin polymerized by pryomellitic anhydride
and phenyl ether through salivating and continuous bi- directional
drawing. It has excellent heat stability, mechanical and dielectric
strength, radiation and chemical resistance, used as a perfect class-
180 electrical insulation material.
Features:
* High mechanical,
electrical properties.
* Excellent flexibility.
* Lower coefficient of thermal expansion and
lower moisture absorption.
Typical Properties:
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PIF-25H
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PIF-50H
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PIF-75H
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Typical thickness mm
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0.025
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0.075
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Thickness tolerance mm
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±0.003
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±0.003
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±0.004
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Basic Weight
g/m2±10%
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35
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70
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105
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Width
mm
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Supply size
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Supplied in rolls; core diameter: 76mm
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* Other thickness are available on customers’
demand.
Properties:
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Property items
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Test methods
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Units
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Typical Value
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1. Visual
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The surface should be even and free from wrinkle,
blister, adhesive particle and impurity.
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2. Density
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ASTM
D1505
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g/cm3
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1.42
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3. Tensile strength
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IPC-TM-650
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≥180
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4. Elongation
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%
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≥45
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5. Tensile Modulus
(MD)
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―――
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2.3
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6. Dielectric strength
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ASTM D149
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kV/mm
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≥180
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7. Volume resistivity
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ASTM D257
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Ω.m
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>1 x 1010
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8. Surface resistivity
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ASTM D257
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> 1 x 1014
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9. Dielectric constant
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IPC-TM-650
Method 2.5.5.3(1MHz)
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3.4
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10. Dissipation factor
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―――
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0.0018
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11. Dimensional Stability
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IPC TM 650, Method 2.2.4A
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%
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≤0.25
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12. Coefficient of thermal
expansion
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Ppm/℃
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27
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13. Moisture absorption
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IPC-TM-650,Method2.6.2
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%
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2.5
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14. Flammability
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UL-94
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V-0
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Application:
Tecpoly IH polyimide film is always
the best choice of high performance polymer materials, especially for
the application of electronic and IC industries that have strict
materials specification. PI is in the position of key materials, such
as high temperature tape, FPC, IC passivation coating, LCD alignment
layer, and insulated materials, etc.
Tecpoly- commodity name registered by Tecnidd, UL recognition
no. E219327
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